Tantalum Sputtering Target - Goodfellow
Tantalum Sputtering Target - Goodfellow
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High Purity Tantalum Sputtering Targets
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Material: TantalumFormula: Ta
Purity: 99.995%
Typical Substrates: Silicon
Related Materials:
Pt, Cu, Al
Tantalum (Ta) is a blue-grey refractory metal, making it an excellent choice for sputtering target material due to its strong corrosion resistance, excellent electrical conductivity, and high melting point. Tantalum can be deposited using both sputtering and evaporation techniques.
The Common Uses of Tantalum in Thin Film Form
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Tantalum (Ta) plays a crucial role in microchip architecture. High purity Ta targets are utilized to sputter thin layers of tantalum onto silicon wafers, facilitating the production of high-performance semiconductor logic chips. Furthermore, it acts as a diffusion barrier in semiconductor processing and as a protective coating in the medical industry.
Typical Properties of Ta in Thin Film Form
Tantalum thin films are known for their excellent electrical and thermal conductivity alongside a high melting point. While the electrical conductivity of Ta is relatively low, it still surpasses that of other materials like aluminum and copper. Additionally, tantalum demonstrates remarkable resistance to chemicals below 150°C and is only soluble in hydrofluoric acid. It possesses the fourth-highest melting point of all metals and can form extremely thin, protective oxide layers for high-quality capacitors.
Typical Deposition Conditions for Tantalum Thin Films by Sputtering
During the sputtering process of tantalum thin films, a substrate temperature ranging from 50-200°C is typically maintained. The base pressure should be around 10-8 Torr, and the argon background gas should be in the range of 0.2-10 mTorr. Sputtering power generally varies between 0.1 and 10 watts per square centimeter. The total sputtering time depends on the desired thickness, typically ranging from 0.5 to 30 minutes.
Related products:
Pt, Cu, Al
If you are looking for more details, kindly visit tantalum sputtering targets.
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